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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.48  No.9 (2007)  >  pp.2336-2339

MATERIALS TRANSACTIONS
<<Previous article Vol.48  No.9 (2007)   pp.2336 - 2339 Next article>>

Comparison of Mechanical Properties of Thin Copper Films Processed by Electrodeposition and Rolling

Masataka Hakamada1), Yoshiaki Nakamoto2), Hiroshi Matsumoto2), Hajime Iwasaki3), Youqing Chen2), Hiromu Kusuda2) and Mamoru Mabuchi2)
1) Materials Research Institute for Sustainable Development, National Institute of Advanced Industrial Science and Technology
2) Graduate School of Energy Science, Kyoto University
3) High Process Research Ltd. Co.


Thin copper films with grain sizes of 31 nm and 3.3 μm were processed by electrodeposition, and their mechanical properties were compared with those of a rolled copper film. The hardness and strength for the electrodeposited copper with a grain size of 3.3 μm were lower than those of the rolled copper with a grain size of 6.3 μm, however, the elongation to failure for the former was larger than that for the latter. Intense (111) texture formation was found for the rolled copper. Therefore, it is suggested that the difference in mechanical properties between the electrodeposited and rolled copper films are related to the texture formation. The electrodeposited copper with a grain size of 31 nm showed higher strength and larger elongation than the rolled copper. The very small grain size of 31 nm gave rise to the excellent mechanical properties.


Keyword:
electrodeposition, thin films, copper, nanocrystalline, mechanical properties

Received: April 19, 2007
Accepted: May 14, 2007 , Published online: August 25, 2007
Copyright (c) 2007 The Japan Institute of Metals

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