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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.49  No.6 (2008)  >  pp.1320-1326

MATERIALS TRANSACTIONS
<<Previous article Vol.49  No.6 (2008)   pp.1320 - 1326 Next article>>

Oblique Angle Deposition of Columnar Niobium Films for Capacitor Application

M. Tauseef Tanvir1), K. Fushimi1), Y. Aoki1) and H. Habazaki1)
1) Graduate School of Engineering, Hokkaido University

Niobium films with isolated columnar morphology have been prepared by oblique angle magnetron sputtering for capacitor application. Anodizing of the deposited niobium to form dielectric niobium oxide reduces the surface roughness, since the gaps between the neighboring columns are filled with the oxide due to large Pilling-Bedworth ratio for Nb/Nb2O5. To increase the gaps between neighboring columns, the influences of the angle of niobium flux to substrate and substrate surface roughness on the columnar morphology of the deposited films have been investigated using scanning electron microscopy and the electrochemical measurements. The deposition on the textured rough substrate surface and at higher angle of the niobium flux from normal to the substrate surface fabricates the niobium films with higher surface roughness.


Keyword:
magnetron sputtering, oblique angle deposition, textured substrate surface, capacitor electrode, dielectric materials, anodic oxide

Received: December 10, 2007
Accepted: February 22, 2008 , Published online: May 25, 2008
Copyright (c) 2008 The Japan Institute of Metals

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