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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.43  No.8 (2002)  >  pp.1854-1857

MATERIALS TRANSACTIONS
<<Previous article Vol.43  No.8 (2002)   pp.1854 - 1857 Next article>>

Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders

Ikuo Shohji1), Tomohiro Yoshida1), Takehiko Takahashi2) and Susumu Hioki2)
1) Faculty of Engineering, Gunma University
2) Akita Prefectural University


The tensile properties of Sn–3.5Ag and Sn–3.5Ag–0.75Cu lead-free solders were investigated. The effect of annealing at 100°C for 1 h before the tensile test on mechanical properties was small in both solders. The tensile strength decreased with decreasing strain rate, and with increasing test temperature. However, the ductility of each solder was relatively constant in the strain rate ranging from 1.67×10−4 s−1 to 1.67×10−2 s−1 and in the test temperature ranging from −40 to 120°C. From the results of the strain-rate-change tests, the strain sensitivity for Sn–3.5Ag and Sn–3.5Ag–0.75Cu were found to be 0.077 and 0.078, respectively.


Keyword:
lead-free solder, tin-silver solder, tin-silver-copper solder, tensile properties, strain sensitivity

Received: February 25, 2002
Accepted: May 30, 2002 , Published online: September 06, 2005
Copyright (c) 2005 The Japan Institute of Metals

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