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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.43  No.8 (2002)  >  pp.1873-1878

MATERIALS TRANSACTIONS
<<Previous article Vol.43  No.8 (2002)   pp.1873 - 1878 Next article>>

Thermodynamics-Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications

Jong Hoon Kim1), Sang Won Jeong1) and Hyuck Mo Lee1)
1) Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology

High temperature solders that will not be affected in the subsequent thermal treatment are required in the step soldering process of multi-chip module (MCM) packaging. High-Pb solder alloys such as 95Pb–5Sn (numbers are all in mass% unless specified otherwise) are currently being used for this purpose. However, the development of the Pb-free solder alloy for high temperature applications is needed due to environmental issues. The solder alloys of Bi–Ag, Sn–Sb and Au–Sb–Sn systems are considered as candidates in this study. Aided by thermodynamic calculations, several specific compositions have been chosen and they were investigated in terms of melting behavior, electrical resistivity, wetting angle and hardness. The Bi–Ag alloy exhibited poor electro-conductivity while the Sn–Sb system had low melting temperatures. The ternary Au–Sn–Sb solder alloy shows prospects for high temperature applications in spite of poor wetting properties.


Keyword:
alloy design, lead-free solder, high-temperature solder, step soldering, tin-antimony, bismuth-silver, gold-tin-antimony

Received: March 15, 2002
Accepted: May 21, 2002 , Published online: September 06, 2005
Copyright (c) 2005 The Japan Institute of Metals

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