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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.43  No.8 (2002)  >  pp.1887-1890

MATERIALS TRANSACTIONS
<<Previous article Vol.43  No.8 (2002)   pp.1887 - 1890 Next article>>

Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film

Yasunori Chonan1)2), Takao Komiyama1), Jin Onuki1), Ryoichi Urao2), Takashi Kimura3) and Takahiro Nagano4)
1) Department of Electronics and Information Systems, Faculty of System Science and Technology,Akita Prefectural University
2) Department of Science and Engineering Ibaraki University
3) Nat’l Inst. for Materials Science
4) Hitachi Central Research Laboratory, Hitachi Ltd.


The interfacial structure and strength of solder joints between Sn–9 mass%Zn solder and plated Au/Ni–P alloy film on a Cu substrate have been investigated. Three reaction layers with 0.2 to 0.5 \micron thickness were formed along the interface between the plated Ni–P alloy films and Sn–9 mass%Zn solder. The outermost layer contains a Ni–Sn intermetallic compound. The middle layer contains approximately 40 mass%Au, 35 mass%Zn, 20 mass%Ni and 5 mass%Sn. The thickness of the Au layer is 0.1 \micron, so the Au layer does not dissolve. The innermost layer contains about 63 mass%Zn, 25 mass%Ni, 10 mass%Au and 2 mass%Sn. The strength of the Sn–9 mass%Zn solder joints take almost the same values independent of P concentration. The strength of Sn–Zn solder joints with Sn–Zn/Ni–2 mass%P, Sn–Zn/Ni–4 mass%P and Sn–Zn/Ni–8 mass%P joints were found to be almost constantly independent of reflow cycles. Therefore, Sn–9 mass%Zn solder is considered to be an excellent solder material for plated Ni–P alloy films.


Keyword:
lead free solder, electroless nickel plating, phosphorus concentration, interfacial structure, solder joint strength, tin-zinc solder

Received: May 29, 2002
Accepted: July 15, 2002 , Published online: September 06, 2005
Copyright (c) 2005 The Japan Institute of Metals

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