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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.42 No.5 (2001)

MATERIALS TRANSACTIONS
<<Previous issue Vol.42 No.5 (2001) Next issue>>

Thermodynamic Analysis of the Sn-Ag-Bi Ternary Phase Diagram
( pp.722 - 731 )
Hiroshi Ohtani1), Isamu Satoh1), Masamitsu Miyashita2) and Kiyohito Ishida3)

 
Activity Measurement of the Constituents in Molten Ag-In-Sn Ternary Alloy by Mass Spectrometry
( pp.732 - 738 )
Takahiro Miki1), Naotaka Ogawa1), Tetsuya Nagasaka1) and Mitsutaka Hino1)

 
Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder
( pp.739 - 744 )
Seok-Hwan Huh1), Keun-Soo Kim1) and Katsuaki Suganuma1)

 
Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test
( pp.745 - 750 )
Tadashi Takemoto1) and Makoto Miyazaki1)

 
The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
( pp.751 - 755 )
Chang-Bae Lee1), Seung-Boo Jung1), Young-Eui Shin2) and Chang-Chae Shur1)

 
Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads
( pp.756 - 760 )
Keisuke Uenishi1), Toshio Saeki1), Yasuhiro Kohara1), Kojiro F. Kobayashi1), Ikuo Shoji2), Masataka Nishiura3) and Masaharu Yamamoto4)

 
Effect of Cooling Rate on Microstructure and Strength Properties of Tin-Silver-Copper Solder Ball Bonding
( pp.761 - 768 )
Kunihiro Noguchi1), Mayumi Ikeda1), Isao Shimizu2), Yoshito Kawamura2) and Yasuhide Ohno2)

 
Aging Behavior of a Sn-Bi Eutectic Solder at Temperatures between 233 and 373 K
( pp.769 - 775 )
Jia Ning Hu1), Hiroyuki Tanaka2) and Toshio Narita1)

 
Influences of Aging Treatment on Microstructure and Hardness of Sn-(Ag, Bi, Zn) Eutectic Solder Alloys
( pp.776 - 782 )
Yasuyuki Miyazawa1) and Tadashi Ariga1)

 
Effect of In Addition on Sn-3.5Ag Solder and Joint with Cu Substrate
( pp.783 - 789 )
Won Kyoung Choi1), Seung Wook Yoon2) and Hyuck Mo Lee1)

 
Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
( pp.790 - 793 )
Ikuo Shohji1), Fuminari Mori2) and Kojiro F. Kobayashi3)

 
Influence of Interfacial Reaction on Reliability of QFP Joints with Sn-Ag Based Pb Free Solders
( pp.794 - 802 )
Akio Hirose1), Toshio Fujii1), Takeshi Imamura1) and Kojiro F. Kobayashi1)

 
Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps
( pp.803 - 808 )
Shinichi Terashima1), Tomohiro Uno1), Eiji Hashino1) and Kohei Tatsumi1)

 
Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis
( pp.809 - 813 )
Young-Eui Shin1), Kyung-Woo Lee1), Kyong-Ho Chang2), Seung-Boo Jung3) and Jae Pil Jung4)

 
Microstructure and Mechanical Properties of Partial Melted Joint Using off Eutectic Lead-Free Solders
( pp.814 - 819 )
Jun Seok Ha1), Choon Sik Kang1), Jae Yong Park2) and Jae Pil Jung3)

 
A Study on the Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5 mass%Ag and Sn-37 mass%Pb Solder
( pp.820 - 824 )
Chang-Bae Park1), Soon-Min Hong2), Jae-Pil Jung1), Choon-Sik Kang2) and Yong-Eui Shin3)

 
Endurance Test of Oxidation-resistant CVD-SiC Coating on C/C Composites for Space Vehicle
( pp.825 - 828 )
Takahiro Sekigawa1), Kazuyuki Oguri1), Jiro Kochiyama2) and Kazuyuki Miho2)

 
Effective Pair Potentials of Molten AgBr Estimated from Experimental Partial Structure Factors
( pp.829 - 832 )
Pavlin Dakev Mitev1), Masatoshi Saito2) and Yoshio Waseda1)

 
Characteristics of HVOF-Sprayed WC-Co Cermet Coatings Affected by WC Particle Size and Fuel/Oxygen Ratio
( pp.833 - 837 )
Byoung Hee Kim1) and Dong Soo Suhr1)

 
Synthesis of Vapor-Grown Carbon Fibers Using Nanocrystalline Fe75Si15B10 Alloy as a Catalyst
( pp.838 - 841 )
Ken Unno1), Hidehiro Kudo1), Atsunori Kamegawa1), Hitoshi Takamura1), Masuo Okada1), Reijiro Takahashi2) and Junichiro Yagi2)

 
Superplastic Deformation of Continuous Fiber Reinforced Titanium Matrix Composites
( pp.842 - 849 )
Takeshi Yamada1), Takayuki Tsuzuku1) and Hiroaki Sato1)

 
Semi-continuous Production of Niobium Powder by Magnesiothermic Reduction of Nb2O5
( pp.850 - 855 )
Il Park1), Toru H. Okabe2), Yoshio Waseda3), Hyo Shin Yu4) and Oh Yeon Lee5)

 
Catalycity Measurement of Oxidation-resistant CVD-SiC Coating on C/C Composite for Space Vehicle
( pp.856 - 861 )
Kazuyuki Oguri1), Takahiro Sekigawa1), Jiro Kochiyama2) and Kazuyuki Miho2)

 
Influence of Copper Addition to α-Fe2Si5 on Thermoelectric Properties of Iron-Silicides Produced by Spark-Plasma Sintering
( pp.862 - 869 )
Kiyoshi Nogi1) and Takuji Kita1)

 
Characteristics of HVOF-Sprayed Cr3C2 (20 mass%NiCr) Coatings Part 2: Effect of Heat Treatment of the Coatings
( pp.870 - 875 )
Byoung Hee Kim1) and Dong Soo Suhr1)

 
Rotating-Beam Fatigue Properties of Pd40Cu30Ni10P20 Bulk Glassy Alloy
( pp.876 - 880 )
Yoshihiko Yokoyama1), Nobuyuki Nishiyama2), Kenzo Fukaura1), Hisakichi Sunada1), Yoshihiro Murakami3) and Akihisa Inoue3)

 
Electrical Resistance in Fe/Al2O3 Multilayered Films Prepared by an Electron Beam Evaporation Method (Electrical Resistance in Fe/Al2O3 Oblique Deposition Multilayers)
( pp.881 - 885 )
Wataru Takakura1), Shoji Ikeda2) and Yuji Ueda1)

 
Formation and Mechanical Properties of Bulk Glassy Ni57-xTi23Zr15Si5Pdx Alloys
( pp.886 - 889 )
Limin Wang1), Chunfei Li1) and Akihisa Inoue2)

 
Reliability Enhancement of Solder Joints Made by a Void Free Soldering Process
( pp.890 - 893 )
Jin Onuki1), Yasunori Chonan2), Takao Komiyama2), Masayasu Nihei1), Masateru Suwa1) and Makoto Kitano3)

 
The Structure of an Al-Ni-Fe Decagonal Quasicrystal Studied by High-Angle Annular Detector Dark-Field Scanning Transmission Electron Microscopy
( pp.894 - 896 )
Kenji Hiraga1) and Tetsu Ohsuna1)

 
The Structure of an Al-Co-Ni Crystalline Approximant with an Ordered Arrangement of Atomic Clusters with Pentagonal Symmetry
( pp.897 - 900 )
Kenji Hiraga1), Tetsu Ohsuna1), Kunio Yubuta1) and Sinya Nishimura1)

 


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