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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.46 No.11 (2005)

MATERIALS TRANSACTIONS
<<Previous issue Vol.46 No.11 (2005) Next issue>>

Mechanism and Prevention of Spontaneous Tin Whisker Growth
( pp.2300 - 2308 )
King-Ning Tu, Jong-ook Suh1), Albert Tzu-Chia Wu2), Nobumichi Tamura3) and Chih-Hang Tung4)

 
Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen
( pp.2309 - 2315 )
Yoshiharu Kariya1), Tomokazu Niimi2), Tadatomo Suga3) and Masahisa Otsuka4)

 
Fatigue Reliability Evaluation for Sn–Zn–Bi and Sn–Zn Lead-Free Solder Joints
( pp.2316 - 2321 )
Qiang Yu1), Jae-Chul Jin1), Do-Seop Kim1) and Masaki Shiratori1)

 
Reliability of Sn–8 mass%Zn–3 mass%Bi Lead-Free Solder and Zn Behavior
( pp.2322 - 2328 )
Sun-Yun Cho1), Young-Woo Lee1), Kyoo-Seok Kim1), Young-Jun Moon2), Ji-Won. Lee2), Hyun-Joo Han2), Mi-Jin Kim2) and Jae-Pil Jung1)

 
Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index
( pp.2329 - 2334 )
Ikuo Shohji1), Kiyokazu Yasuda2) and Tadashi Takemoto3)

 
Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders
( pp.2335 - 2343 )
Takehiko Takahashi1), Susumu Hioki1), Ikuo Shohji2) and Osamu Kamiya3)

 
Formation of Intermetallic Compounds in the Ni Bearing Lead Free Composite Solders
( pp.2344 - 2350 )
Joo Won Lee1), Zin Hyoung Lee1) and Hyuck Mo Lee1)

 
IMC Growth of Solid State Reaction between Ni UBM and Sn–3Ag–0.5Cu and Sn–3.5Ag Solder Bump Using Ball Place Bumping Method during Aging
( pp.2351 - 2358 )
Shinji Ishikawa1), Eiji Hashino1), Taro Kono2) and Kohei Tatsumi1)

 
Flip Chip Bump Formation of Sn–1.8Bi–0.8Cu–0.6In Solder by Stencil Printing
( pp.2359 - 2365 )
Jaesik Lee1), Jae-Pil Jung2), Chu-Seon Cheon3), Yunhong Zhou1) and Michael Mayer1)

 
Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
( pp.2366 - 2371 )
Dae-Gon Kim1) and Seung-Boo Jung1)

 
Shear Fracture Behavior on Ball Grid Arrayed Tin–Silver–Copper Solder/Pure Copper Pad Joint Interface
( pp.2372 - 2379 )
Kunihiro Noguchi1), Y\={u}ya Endou2), Isao Shimizu3) and Yasuhide Ohno3)

 
Joints Soldered on Electroless Ni–Au Surfaces Using Cu-Containing Flux: Strength, Microstructure and Mechanism of Improvement
( pp.2380 - 2385 )
Seishi Kumamoto1), Hitoshi Sakurai2), Kazuki Ikeda2) and Katsuaki Suganuma1)

 
Interfacial Reaction and Mechanical Characterization of Eutectic Sn–Zn/ENIG Solder Joints during Reflow and Aging
( pp.2386 - 2393 )
Jeong-Won Yoon1), Hyun-Suk Chun1) and Seung-Boo Jung1)

 
Interfacial Reaction between Sn–Ag–Co Solder and Metals
( pp.2394 - 2399 )
Hiroshi Nishikawa1), Akira Komatsu2) and Tadashi Takemoto1)

 
Microstructural Evolution of Joint Interface between Eutectic 80Au–20Sn Solder and UBM
( pp.2400 - 2405 )
Sung Soo Kim1), Jong Hoon Kim1), Seong Woon Booh2), Tae-Gyu Kim2) and Hyuck Mo Lee1)

 
Reactivity between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases
( pp.2406 - 2412 )
Takashi Yamamoto1), Shigeaki Sakatani1), Shinji Kobayashi1), Keisuke Uenishi2), Kojiro F. Kobayashi1), Masaaki Ishio3), Kazuhiro Shiomi3), Akio Hashimoto3) and Masaharu Yamamoto4)

 
Interfacial Properties of Zn–Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate
( pp.2413 - 2418 )
Jae-Ean Lee1), Keun-Soo Kim2), Katsuaki Suganuma2), Junichi Takenaka3) and Koichi Hagio3)

 
Microstructure Control in Sn–0.7 mass%Cu Alloys
( pp.2419 - 2425 )
Kazuhiro Nogita1), Jonathan Read1), Tetsuro Nishimura2), Keith Sweatman2), Shoichi Suenaga2) and Arne K. Dahle1)

 
Isoplethal Sections of the Liquidus Projection and the 250°C Phase Equilibria of the Sn–Ag–Cu–Ni Quaternary System at the Sn-Rich Corner
( pp.2426 - 2430 )
Chen-nan Chiu1), Yu-chih Huang1), An-ren Zi1) and Sinn-wen Chen1)

 
Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder
( pp.2431 - 2436 )
Ying-Hui Wang1), Matiar R Howlader2), Kenji Nishida3), Takashi Kimura3) and Tadatomo Suga1)2)

 
Identification of β Phase Particles in an Isothermally Aged Al–10 mass%Mg–0.5 mass%Ag Alloy
( pp.2437 - 2442 )
Masahiro Kubota1)

 
Development of Observation Method for Tempered Martensite Microstructure Using Chemical Mechanical Polishing Technique
( pp.2443 - 2448 )
Masao Hayakawa1), Saburo Matsuoka2), Yoshiyuki Furuya1) and Yoshinori Ono1)

 
Grain Refinements of Al–Mg Alloy by Hydrogen Heat-Treatments
( pp.2449 - 2453 )
Atsunori Kamegawa1), Takao Funayama1), Junya Takahashi1), Hitoshi Takamura1) and Masuo Okada1)

 
Ferrite Grain Size Formed by Large Strain-High Z Deformation in a 0.15C Steel
( pp.2454 - 2460 )
S. V. S. Narayana Murty1), Shiro Torizuka1) and Kotobu Nagai1)

 
Empirical Equations for Bubble Formation Frequency from Downward-Facing Nozzle with and without Rotating Flow Effects
( pp.2461 - 2466 )
Tomoya Goda1), Manabu Iguchi2), Yasushi Sasaki3) and Hiromichi Kiuchi2)

 
The Dependence of Coating Characteristics on Progress Parameters and Alloy Compositions
( pp.2467 - 2472 )
Olga. P. Terleeva1), Young-Joo Oh2), Myoung-Ryul Ok2), Vladimir V. Utkin1), Heon-Phil Ha2) and Dong-Heon Lee3)

 
Residual Stress Distribution in Thermally Sprayed Self-Fluxing Alloy Coatings
( pp.2473 - 2477 )
Fumitaka Otsubo1), Katsuhiko Kishitake1) and Toshio Terasaki1)

 
Influence of Heat Treatment on the Distribution of Ni2Nb and Microsegregation in Cast Inconel 718 Alloy
( pp.2478 - 2483 )
Nader El-Bagoury1), Toru Matsuba1), Kaoru Yamamoto1), Hirofumi Miyahara1) and Keisaku Ogi1)

 
Tensile Properties of Diffusion Bonds between TiAl Intermetallic Compound and Titanium Alloy
( pp.2484 - 2489 )
Satoru Kanai1), Sachio Seto1) and Hiroyuki Sugiura1)

 
AE Source and Relation between AE Activity and Rate of Corrosion of Oil Tank Bottom Plate on Acidic Soils
( pp.2490 - 2496 )
Sosoon Park1), Shigeo Kitsukawa2), Kenji Katoh3), Sigenori Yuyama4), Hiroaki Maruyama5) and Kazuyoshi Sekine1)

 
Fabrication of Cemented Carbide Molds with Internal Cooling Channels Using Hybrid Process of Powder Layer Compaction and Milling
( pp.2497 - 2503 )
Yoshiaki Mizukami1) and Kozo Osakada2)

 
Preparation of TiB2–SiC Eutectic Composite by an Arc-Melted Method and Its Characterization
( pp.2504 - 2508 )
Wen-Jun Li1), Rong Tu1) and Takashi Goto1)

 
Nanosize Particles of ZrVFe Alloy by Pulsed Laser Ablation in Ethanol
( pp.2509 - 2513 )
Daesup Kil1), Yongjae Suh1), Heedong Jang1), Jaechen Lee1), Changbin Song2) and Wonbaek Kim1)

 
Orientation of Hydroxyapatite C-Axis under High Magnetic Field with Mold Rotation and Subsequent Sintering Process
( pp.2514 - 2517 )
Jun Akiyama1), Masami Hashimoto2), Hiroaki Takadama2), Fukue Nagata3), Yoshiyuki Yokogawa3), Kensuke Sassa1), Kazuhiko Iwai1) and Shigeo Asai1)

 
Bi2Te3-Related Thermoelectric Samples with Aligned-Texture Prepared by Plastic Deformation
( pp.2518 - 2524 )
Yoshinori Morisaki1), Hiroshi Araki1), Hiroyuki Kitagawa1), Masaki Orihashi2), Kazuhiro Hasezaki1) and Keiichi Kimura3)

 
Microstructure and Thermoelectric Properties of Hot-Pressed n-Type Bi1.9Sb0.1Te2.6Se0.4 Alloys Prepared Using a Rapid Solidification Technique
( pp.2525 - 2529 )
Yuma Horio1), Hiroyuki Yamashita1) and Takahiro Hayashi1)

 
Effects of Substrate Temperature and Oxygen Pressure on Crystallographic Orientations of Sputtered Nickel Oxide Films
( pp.2530 - 2535 )
Hao-Long Chen1), Yang-Ming Lu2), Jun-Yi Wu2) and Weng-Sing Hwang1)

 
Ag–Ti Alloy Used in ITO–Metal–ITO Transparency Conductive Thin Film with Good Durability against Moisture
( pp.2536 - 2540 )
Shi-Wei Chen1), Chun-Hao Koo1), Hsin-Erh Huang2) and Chia-Hua Chen2)

 
Ce–Cu–Fe–Al–Si Bulk Metallic Glass Alloys With High Glass Forming Ability
( pp.2541 - 2544 )
Zan Bian1) and Akihisa Inoue1)

 
A Bulk Glassy Cu–Zr–Ti–Sn Alloy with Superior Plasticity
( pp.2545 - 2547 )
Hua Men1) and Tao Zhang1)

 


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