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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.57 No.6 (2016)

MATERIALS TRANSACTIONS
<<Previous issue Vol.57 No.6 (2016) Next issue>>

Special Issue on Advanced Spintronic/Nano-Magnetic Materials
( p.759 )
Yu Shiratsuchi1), Koki Takanashi2)

 
Finely Controlled Approaches to Formation of Heusler-Alloy/Semiconductor Heterostructures for Spintronics
( pp.760 - 766 )
Kohei Hamaya1), Makoto Kawano1), Yuichi Fujita1), Soichiro Oki1), Shinya Yamada1)

 
Spin Injection, Transport, and Detection in a Lateral Spin Transport Devices with Co2FeAl0.5Si0.5/n-GaAs, Co2FeSi/MgO/n-Si, and CoFe/MgO/n-Si Junctions
( pp.767 - 772 )
Nobuki Tezuka1), Yoshiaki Saito2)

 
Interface Magnetic Anisotropy of Pd/Co2FexMn1−xSi/MgO Layered Structures
( pp.773 - 776 )
Takahide Kubota1), Tomonari Kamada1), Jinhyeok Kim1), Arata Tsukamoto2), Shigeki Takahashi3), Yoshiaki Sonobe3), Koki Takanashi1)

 
Magnetic Properties of Spinel Ferrite Thin Films Grown by Reactive Sputtering
( pp.777 - 780 )
Hideto Yanagihara1), Sonia Sharmin1), Tomohiko Niizeki1) 2), Eiji Kita1)

 
Perpendicular Exchange Bias and Magneto-Electric Control Using Cr2O3(0001) Thin Film
( pp.781 - 788 )
Yu Shiratsuchi1), Ryoichi Nakatani1)

 
Anomalous Hall Effect Measurement on Nanostructure with Magnetic Pulse Fields
( pp.789 - 795 )
Nobuaki Kikuchi1) 2), Satoshi Okamoto1) 2), Osamu Kitakami1) 2)

 
Special Issue on Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing for Such Materials
( p.796 )
Yoshiharu Kariya1), Ikuo Shohji2)

 
Molten Lead-Free Solder Deposited by Inkjet Printing for Bonding of Thin-Film Solar Cell Modules
( pp.797 - 804 )
Chien-Hsun Wang1), Weng-Sing Hwang1), Wen-Ming Chen1), Ho-Lin Tsai1), Cheng-Han Wu1)

 
Thermal Fatigue Life Evaluation of Epoxy Resin/Si Joint under Mineral Oil Condition
( pp.805 - 809 )
Hideto Takahashi1), Yoshiharu Kariya2)

 
Effect of Interfacial Hardness on Failure Modes of Liquid Phase Diffusion Bonded Sn/Sn with Bi Filler
( pp.810 - 814 )
Shinji Koyama1), Issei Oya1), Ikuo Shohji1)

 
In Situ Observation of Self-Annealing Behaviors of (001)-Oriented Electrodeposited Silver Film by EBSD Method
( pp.815 - 818 )
Yumi Hayashi1), Hiroshi Miyazawa1) 2), Kohei Minamitani3), Ikuo Shohji1)

 
Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals in Principal Axes
( pp.819 - 823 )
Yuichi Yanaka1), Yoshiharu Kariya2), Hirohiko Watanabe3), Hiroaki Hokazono3)

 
Application of Spark Sintering to Preparation of Zn-50Sn-Al2O3/Cu Joints for AC-Low Voltage Fuse Elements Without Lead
( pp.824 - 832 )
Kazuhiro Matsugi1), Hiromu Matsumoto1), Zhe-Feng Xu1), Yong-Bum Choi1), Ken-ichiro Suetsugu2), Koji Fujii3)

 
Microstructure and Shear Strength of Low-Silver SAC/Cu Solder Joints during Aging
( pp.833 - 837 )
Hu Luo1), Gui-sheng Gan1) 3), Yunfei Du2), Donghua Yang1), Huaishan Wang1), Guoqi Meng1)

 
Observation on Isothermal Reactive Diffusion between Solid Ni and Liquid Sn
( pp.838 - 845 )
Akihiro Nakane1), Takao Suzuki1), Minho O2), Masanori Kajihara2)

 
Effect of Zinc Addition on Void Formation in Solid-Liquid Interdiffusion Bonding of Copper
( pp.846 - 852 )
S. Fukumoto1), T. Miyazaki2), M. Matsushima1), K. Fujimoto1)

 
Effect of Strain Rate and Temperature on Micro Fatigue Crack Propagation of Bi-Sn Eutectic Alloy
( pp.853 - 859 )
Maiko Taniguchi1), Yoshiharu Kariya2)

 
Reliable Material Properties of Aluminum Pads with Strong Delamination Toughness in Gold - Aluminum Wire Bonding
( pp.860 - 864 )
Toru Ikeda1), Kenta Shiba1)

 
Evolution of Electrical Conductivity in Silver-Loaded Electrically Conductive Adhesives Composed of an Amine-Cured Epoxy-Based Binder
( pp.865 - 872 )
Yoshiaki Sakaniwa1), Yasunori Tada2), Masahiro Inoue2)

 
Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder
( pp.873 - 880 )
Zhang Haidong1), Ikuo Shohji1), Masayoshi Shimoda2), Hirohiko Watanabe2)

 
Effects of Metal Surface Conditions on Interfacial Characteristics between Metal and Epoxy Resin
( pp.881 - 886 )
Michiya Matsushima1), Yuta Kato1), Yusuke Takechi1), Shinji Fukumoto1), Kozo Fujimoto1)

 
Interfacial Reactions in Sn-57Bi-1Ag Solder Joints with Cu and Au Metallization
( pp.887 - 891 )
Hanae Hata1), Yuuki Maruya2), Ikuo Shohji1)

 
Magneto-Optical Enhancement and Chemical Sensing Applications of Perpendicular Magnetic CoPt/Ag Stacked Structures with a ZnO Intermediate Layer
( pp.892 - 897 )
H. Yamane1), K. Takeda2), M. Kobayashi2)

 
Magnetically Retarded Recovery and Recrystallization in Cold Rolled Pure Copper
( pp.898 - 902 )
He Tong1), Zhang Guojin2), Jia Nan2), Zhao Xiang2)

 
Electric Evolution in Sputter-Deposited SncSnSi1−cSn Alloy Films
( pp.903 - 906 )
Kenji Sumiyama1), Yuichiro Kurokawa2), Hirotaka Yamada1), Minoru Yamazaki1), Takehiko Hihara2)

 
Electric and Magnetic Evolution in Sputter-Deposited FexSi1−x Alloy Films
( pp.907 - 912 )
Kenji Sumiyama1), Minoru Yamazaki1), Takeshi Yoneyama1), Kohdai Suzuki1), Kohji Takemura1), Yuichiro Kurokawa2), Takehiko Hihara2)

 
Effects of Cerium Addition on the Microstructure, Mechanical Property and Creep Behavior of AM60B Magnesium Alloy
( pp.913 - 917 )
Xiaodong Sun1), Wenyun Wu1), Donghong Wang1), Peiran Deng1), Heping Lv2)

 
Three-Dimensional Imaging of a Long-Period Stacking Ordered Phase in Mg97Zn1Gd2 Using High-Voltage Electron Microscopy
( pp.918 - 921 )
Kazuhisa Sato1) 2), Shunya Tashiro3), Yohei Yamaguchi3), Takanori Kiguchi1), Toyohiko J. Konno1), Tomokazu Yamamoto4), Kazuhiro Yasuda4), Syo Matsumura4)

 
Simulation of the Si Precipitation Process in Mg2Si Using a Phase-Field Kinetic Model
( pp.922 - 926 )
Bin Liu1), Teruyuki Ikeda2), Yasushi Sasajima2) 3)

 
Grain Refinement and Ductility Improvement by Hot Extrusion Using a Heteromorphic Die with Small Holes
( pp.927 - 934 )
Kaho Tomita1), Toko Tokunaga1), Munekazu Ohno2), Kiyotaka Matsuura2)

 
Effect of Hydrothermal Treatment Coupled with Mechanical Compression on Equilibrium Water Content of Loy Yang Lignite and Mechanism
( pp.935 - 942 )
Xiangchun Liu1), Tsuyoshi Hirajima1) 2), Moriyasu Nonaka1), Keiko Sasaki1)

 
Effects of Homogeneous Low Energy Electron Beam Irradiation (HLEBI) on Adhesive Energy of Peeling Resistance of Laminated Sheet with Polyurethane (PU) and Polyethylene Terephthalate (PET)
( pp.943 - 948 )
Sagiri Takase1), Chisato Kubo1), Masae Kanda1) 2), Yoshihito Matsumura1) 2), Yoshitake Nishi1) 2)

 
Detection and Thickness Estimation of Water Layer in Layered Medium Based on Multi-Reflection of Oblique Incident Ultrasonic Wave
( pp.949 - 958 )
Yang Shen1), Sohichi Hirose1)

 
Effect of Mn Addition on the Age-Hardening Behavior of an Al-(9–10)%Si-0.3%Mg Die Casting Alloy in T5 and T6 Heat Treatment
( pp.959 - 965 )
Keita Fukasawa1), Ryousuke Mohri1), Tetsuo Ohtake1), Tatsuya Inoue1), Akihiro Kuroda2), Hiroshi Kambe3), Makoto Yoshida4)

 
Effect of Shot Peening on Bending Strength of Magnesium Pipe
( pp.966 - 972 )
Yasunori Harada1), Izumi Fukuda2), Atsushi Yamamoto1)

 
Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin–Lead Solder on “Surface Fine Crevice Structure”
( pp.973 - 977 )
Masashi Nakamoto1), Atsushi Fukuda1), Jenna Pinkham2), Siboniso Vilakazi1), Hiroki Goto1), Ryo Matsumoto1), Hiroshi Utsunomiya1), Toshihiro Tanaka1)

 
Effect of Excess Energy on Supersaturated Fe-IIIB Thin Films Formation by Ion Plating
( pp.978 - 982 )
Akitaka Sakai1), Chonlawich Niyomwaitaya1), Takaaki Iijima2), Akira Tonegawa3), Yoshihito Matsumura1)

 
Aluminium-Silicon-Magnesium Filler Metal for Aluminium Vacuum Brazing Wettability and Characteristics of Brazing Microstructure
( pp.983 - 987 )
Tuoyu Yang1) 2), Deku Zhang1), Kehong Wang1), Jun Huang1)

 
A Feasibility Study on the Three-Dimensional Friction Stir Welding of Aluminum 5083-O Thin Plate
( pp.988 - 994 )
Young-Gon Kim1), In-Ju Kim1), Young-Pyo Kim2), Sung-Min Joo3)

 
A Novel Method of Antibacterial Evaluation Based on the Inhibition of Hydrogen Sulfide Producing Activities of Salmonella
–Using Copper as a Model Antibacterial Agent–
( pp.995 - 1000 )
Yutaka Midorikawa1), Masaaki Nakai2), Kaoru Midorikawa3), Mitsuo Niinomi2)

 
Constituent Element Addition to n-Type Bi2Te2.67Se0.33 Thermoelectric Semiconductor without Harmful Dopants by Mechanical Alloying
( pp.1001 - 1005 )
Kazuhiro Hasezaki1), Sena Wakazuki2), Takuya Fujii2), Masato Kitamura2)

 
A Method for Studying the Nano-Scale Stress-Strain Response of a Material by Nanoindentation
( pp.1006 - 1009 )
Naoki Fujisawa1), Tomo Ogura2), Akio Hirose2)

 
Measurement of Thermal Expansion Coefficient of 18R-Synchronized Long-Period Stacking Ordered Magnesium Alloy
( pp.1010 - 1013 )
Nobuhiro Yasuda1), Shigeru Kimura1)

 
Foaming Behavior of Aluminum Foam Precursor Using Only Friction Heat of Rotating Tool
( pp.1014 - 1016 )
Yoshihiko Hangai1), Tomoaki Morita1), Takao Utsunomiya2)

 


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