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Home  >  Journal list  >  Journal of the Society of Materials Science, Japan  >  Vol.56  No.10 (2007)  >  pp.932-937

Journal of the Society of Materials Science, Japan
<<Previous article Vol.56  No.10 (2007)   pp.932 - 937 Next article>>

Development of Novel MEMS Soldering Technique Using Self-Propagating Exothermic Reaction in Al/Ni Multilayer Films

Hiroshi FUJITA1), Takahiro NAMAZU1) and Shozo INOUE1)
1) Dept. of Mech. & System Eng., Univ. of Hyogo


This paper describes a novel local heat process technique for MEMS soldering technology. Al/Ni multilayer film deposited by DC magnetron sputtering shows self-propagating exothermic reaction. By applying a spark to the reactive film, the film generates heat enough to melt Au-Sn solder film. The heat of reaction depended on Al/Ni bilayer thickness and the total film thickness. We used the Al/Ni multilayer film as a local heat source in MEMS soldering packages. Au-Sn solder film-bonded silicon elements by the local heating was fabricated without other external heat sources, and the bond strength was characterized. The local heating technique by Al/Ni multilayer film's exothermic reaction would likely have the potential for MEMS soldering technology.


Keyword:
Al/Ni multilayer film, Self-propagating exothermic reaction, MEMS package, Au-Sn solder film

Received: December 01, 2006
Published online: October 18, 2007
Copyright (c) 2007 by The Society of Materials Science, Japan

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