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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.49  No.2 (2008)  >  pp.275-277

MATERIALS TRANSACTIONS
<<Previous article Vol.49  No.2 (2008)   pp.275 - 277 Next article>>

Effects of Ultrasound on Morphology of Copper Electrodeposited on Titanium in Aqueous and Organic Solutions

Bo Hong1), C. H. Jiang1) and X. J. Wang1)
1) School of Materials Science and Engineering, Shanghai Jiao Tong University

The copper films were electrodeposited from aqueous and organic solutions in the presence and in the absence of ultrasound. The internal stress and texture in copper films were studied using the X-ray diffraction (XRD). The results showed that the internal stress and texture of the copper films were reduced on the effect of ultrasound. The surface morphology of copper grains was investigated using scanning electron microscopy (SEM). The results showed that the porous structure was formed on the surface of copper grains deposited in organic solution under ultrasonic radiation.


Keyword:
electrodeposited copper films, internal stress, texture, surfaces, porosity

Received: July 06, 2007
Accepted: November 29, 2007 , Published online: January 25, 2008
Copyright (c) 2008 The Japan Institute of Metals

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