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Home  >  Journal list  >  Journal of the Ceramic Society of Japan  >  Vol.116  No.1352 (April) (2008)  >  pp.550-554

Journal of the Ceramic Society of Japan
<<Previous article Vol.116  No.1352 (April) (2008)   pp.550 - 554 Next article>>

Synthesis and characterization of high temperature stable epoxy adhesive

S. G. YOON1), E. S. KIM1), N. K. KANG2), W. S. LEE2) and Y. H. KIM1)
1) Department of Materials Engineering, Kyonggi University
2) Electronic Materials & Packaging Center, KETI


  For the integration of multi-chip module required thermally stable epoxy adhesive, the effects of clay incorporation on the thermal stability of cured epoxy adhesive were investigated. Various epoxy adhesives were prepared as a function of a number of epoxy rings and the amount of hardener. Based on the relationship between the glass transition temperature (Tg) and cross-linking density obtained from the curing mechanism analyzed by FT-IR, the epoxy adhesive with Tg higher than 200°C was synthesized by raising cross-linking density to the maximum. With the incorporation of clay, the curing reaction rate and the degradation of epoxy adhesive can be controlled. The epoxy/clay composite showed the higher height of tanδ peak than that of pure epoxy adhesive.


Keyword:
Epoxy adhesive, Epoxy/clay nanocomposies, Cross-linking density, Glass transition temperature, Thermal stability

Received: November 19, 2007
Accepted: February 21, 2008 , Published online: April 01, 2008
Copyright (c) 2008 The Ceramic Society of Japan

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