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Home  >  Journal list  >  Journal of the Society of Materials Science, Japan  >  Vol.57  No.11 (2008)  >  pp.1153-1159

Journal of the Society of Materials Science, Japan
<<Previous article Vol.57  No.11 (2008)   pp.1153 - 1159 Next article>>

Theoretical and Experimental Study of Warp Deformation Behavior with Chemical Reaction and Thermal Load for Viscoelastic Laminated Body

Shozo NAKAMURA1), Takaaki TANAKA2) and Tsukasa SHINOHARA2)
1) Dept. of Int. Mech. Eng., Fac. of Tech., Hiroshima Inst. of Tech.
2) Hiroshima Inst. of Tech.

Epoxy resin is usually used as an encapsulation of IC chips for electronic parts. As for the epoxy resin, a state changes from liquid to solid by the chemical reaction. Hereby, the residual stresses and warp deformation occure in the electronic parts. In this report, the warp deformation for two laminated bodies consisting of epoxy resin and steel, epoxy resin and printed board caused by chemical reaction and thermal load was examined by experiment and theory. In other words, the theoretical content is the thermo-viscoelastic analysis based on the linear viscoelasticity theory and simple prediction solution about the laminated bodies consisted of above-mentioned materials. As a result, it was clarified that the warp deformation for the laminated bodies generated by chemical reaction and thermal load could be predicted by using the combination of thermo-viscoelastic analysis and simple prediction solution which was derived from the bending theory of beam, and that the percentage of the warp deformation caused by chemical reaction was about 15∼20% of the total warp deformation for the laminated bodies.

Viscoelasticity, Warp deformation, Numerical analysis, Chemical reaction, Epoxy resin, Laminate

Received: February 20, 2008
Published online: November 20, 2008
Copyright (c) 2008 by The Society of Materials Science, Japan



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