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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.52  No.1 (2011)  >  pp.102-107

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Effect of Texture and Grain Size on the Deformation Behavior of Sputtered Thick Al-Si Films during Cyclic Heating and Cooling

T. Kurosu1)2), Y. Shimizu2), Y. Tomota3) and J. Onuki4)
1) Power and Industrial Division, Hitachi Ltd.
2) Graduate School of Science and Engineering, Ibaraki University
3) Institute of Applied Beam Science, Graduate School of Science and Engineering/Frontier Research Center for Applied Atomic Sciences, Ibaraki University
4) Department of Materials Science, Faculty of Engineering, Ibaraki University

Thick (8 μm) Al-Si films both on poly Si (0.5 μm thick)/SiO2/Si and SiO2/Si substrates were subjected to cyclic current application or cyclic heating and cooling. Both the cyclic current application and the cyclic heating and cooling led to specimen surface roughening. The average roughness increased with the number of cycles, but the extent of roughness for the former was much larger than that for the latter. These results correspond to the fact that grain size and texture for the latter are two times larger and more [111] oriented than those for the former, respectively. According to Electron Back Scattering Pattern (EBSP) measurements, grains with an orientation deviating from [111] were found to deform heavily during the cyclic current charging or heating, resulting in grain extrusion on the surface.

deformation behavior of thick aluminum-silicon films, cyclic heating and cooling, texture, grain size

Received: September 06, 2010
Accepted: November 04, 2010 , Published online: December 25, 2010
Copyright (c) 2011 The Japan Institute of Metals



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