You are not logged in Total: 7journals, 20,687articles Online
Login / Register
Forgot Login?
Main menuMain menu
What's new
Journal list
Visiting ranking
Phrase ranking
About us
Journal Site
Advanced Search

Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.52  No.8 (2011)  >  pp.1553-1559

<<Previous article Vol.52  No.8 (2011)   pp.1553 - 1559 Next article>>

Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint

Sang-Su Ha1), Jongwoo Park1) and Seung-Boo Jung2)
1) Quality & Reliability Team, Samsung Electronics Co., Ltd.
2) School of Advanced Materials Science and Engineering, Sungkyunkwan University

The reliability of lead-free electronic assemblies after board-level drop tests was investigated. The effects of different PCB (Printed Circuit Board) surface finishes, viz. ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), after reflow and thermal aging (1,000 h at 125°C) were studied. The increase of IMCs (Intermetallic Compounds) thickness after thermal aging in all of boards. However, as the change of the thickness of the IMC in the ENEPIG board before and after thermal aging was smaller than that of the ENIG board. The results of the drop test, ENEPIG board has greater reliability after reflow than the ENIG board and shows excellent characteristics under all conditions after thermal aging.

board-level drop test, lead-free solder, surface finish, microstructure, thermal aging

Received: April 11, 2011
Accepted: May 09, 2011 , Published online: July 25, 2011
Copyright (c) 2011 The Japan Institute of Metals



Terms of Use | Privacy Policy