You are not logged in Total: 7journals, 20,538articles Online
AccountAccount
Login / Register
Forgot Login?
 
Main menuMain menu
What's new
Journal list
Visiting ranking
Phrase ranking
Polls
About us
 
SearchSearch
 
Journal Site
Advanced Search
 

Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.53  No.3 (2012)  >  pp.578-581

MATERIALS TRANSACTIONS
<<Previous article Vol.53  No.3 (2012)   pp.578 - 581 Next article>>

Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)

Byung-Seung Yim1), Seung-Hoon Oh1), Jiwon Kim2), Jooheon Kim2) and Jong-Min Kim1)
1) School of Mechanical Engineering, Chung-Ang University
2) School of Chemical Engineering & Material Science, Chung-Ang University


A new class of functionalized graphene-filled solderable isotropically conductive adhesive (ICA) has been developed using a low-melting-point alloy (LMPA) fillers. The mechanical and electrical characteristics of formulated ICAs were investigated and compared with those of three kinds of conventional ICAs filled with Ag particles. The functionalized graphene-filled solderable ICA formed good metallurgical interconnection between upper and corresponding lower electrode. The developed ICA exhibit lower electrical resistance and higher mechanical strength compared with those of conventional ICAs. In addition, the thermal conductivity was improved about 20% by adding functionalized graphene compared with that of solderable ICA without graphene.


Keyword:
isotropically conductive adhesive (ICA), graphene, low-melting-point alloy, polymeric composites

Received: December 08, 2011
Accepted: December 21, 2011 , Published online: February 25, 2012
Copyright (c) 2012 The Japan Institute of Metals

PDFPDF file (J-STAGE)J-STAGEJ-STAGE


SPARC Japan

Terms of Use | Privacy Policy