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Home  >  Journal list  >  Journal of the Ceramic Society of Japan  >  Vol.120  No.1400 (April) (2012)  >  pp.150-154

Journal of the Ceramic Society of Japan
<<Previous article Vol.120  No.1400 (April) (2012)   pp.150 - 154 Next article>>

Effect of additives on compressive strength and thermal conductivity of vermiculite-silica composites with layered structure

Jung-Hye EOM1), Young-Wook KIM1), Doo-Hoa JEONG2) and Seung-Seok LEE3)
1) Functional Ceramics Laboratory, Department of Materials Science and Engineering, The University of Seoul
2) POSCO
3) Hybrid Materials Research Department, Research Institute of Industrial Science & Technology


  The effect of additives on compressive strength and thermal conductivity of vermiculite-SiO2 composites with a layered structure was investigated. Anisotropy in both properties was observed because of the layered structure produced by cellulose fibers. Both compressive strengths (58–123 MPa) and thermal conductivities (1.29–1.34 W/m·K) in the direction perpendicular to the pressing direction (T) were higher than those (22–68 MPa and 0.45–1.13 W/m·K) in the direction parallel to the pressing direction (S) in all samples. The compressive strength and thermal conductivity of the vermiculite-SiO2 composite containing no additives were 54 MPa and 1.13 W/m·K when measured parallel to the pressing direction, respectively. In contrast, those of the composite containing 5 mass % TiO2 and 5 mass % SiC were 68 MPa and 0.45 W/m·K when measured parallel to the pressing direction, respectively.


Keyword:
Refractory, Thermal insulator, Vermiculite, Layered structure

Received: October 27, 2011
Accepted: January 30, 2012 , Published online: March 28, 2012
Copyright (c) 2012 The Ceramic Society of Japan

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