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Home  >  Journal list  >  Polymer Journal  >  Vol.45  No.6 (2013)  >  pp.594-600

Polymer Journal
<<Previous article Vol.45  No.6 (2013)   pp.594 - 600 Next article>>

Highly soluble phenylethynyl-terminated imide oligomers based on KAPTON-type backbone structures for carbon fiber-reinforced composites with high heat resistance

Masahiko Miyauchi1, Yuichi Ishida2, Toshio Ogasawara2 and Rikio Yokota3
1Frontier Materials Development Laboratories, Kaneka Corporation, Osaka, Japan
2Aerospace Research of Directorate, Japan Aerospace Exploration Agency (JAXA), Tokyo, Japan
3Institute of Space and Astronautical Science (ISAS), Japan Aerospace Exploration Agency (JAXA), Kanagawa, Japan

Novel addition-type phenylethynyl-containing imide oligomers (degree of polymerization: n=1–10) derived from 1,2,4,5-benzenetetracarboxylic dianhydride or pyromellitic dianhydride (PMDA), 2-phenyl-(4,4′-diaminodiphenyl ether) (p-ODA) and 4-phenylethynylphthalic anhydride (PEPA) were prepared and evaluated as a matrix resin for high heat-resistant carbon fiber-reinforced composites. The uncured imide oligomers showed good solubility (>30wt%) in N-methyl-2-pyrrolidone and very low melt viscosities. These imide oligomers were successfully converted to crosslinked structures after curing at 370°C. The glass transition temperature (Tg) and the elongation at break (εb) of the cured imide resin were found to be excellent (almost 340°C and >15%, respectively). The carbon fiber prepreg was prepared from the imide oligomer solution and used to fabricate void-free laminates with high Tg. The thermal and mechanical properties of the laminates were determined at ambient temperature.

asymmetric structure; carbon fiber-reinforced composites; polyimide

Received: April 30, 2012 , Revised: June 19, 2012
Accepted: June 20, 2012 , Published online: September 12, 2012
© 2013 The Society of Polymer Science, Japan

NatureAbstract (Nature)


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