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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.56  No.2 (2015)  >  pp.175-181

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Selected Topics on Material Strength and Thermally Activated Deformation Processes

Masaharu Kato1)
1) Department of Materials Science and Engineering, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology

Thermally activated deformation processes are discussed with reference to the studies done by the present author and his coworkers. First, dislocation motion in one- and two-dimensional periodic stress fields is analyzed to understand the deformation mechanisms of bcc metals and spinodally decomposed alloys. The role of the thermally activated kink-pair formation on the temperature and strain-rate dependence of strength is also discussed. Secondly, diffusion-controlled processes pertinent to high-temperature deformation are discussed by applying a unified and fundamental rate equation derived previously. Thirdly, mechanisms for the temperature and strain-rate dependence of polycrystals and ultrafine-grained and nanocrystalline materials are introduced. A proposed model taking into account the thermally activated dislocation depinning at grain boundaries is discussed.

thermally activated deformation, strength, dislocation, ultra-fine grained materials, grain boundaries

Received: November 04, 2014
Accepted: November 21, 2014 , Published online: January 25, 2015



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