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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.56  No.11 (2015)  >  pp.1852-1856

MATERIALS TRANSACTIONS
<<Previous article Vol.56  No.11 (2015)   pp.1852 - 1856 Next article>>

Metal–Metal Joining by Unusual Wetting on Surface Fine Crevice Structure Formed by Laser Treatment

Atsushi Fukuda1), Hiroyuki Matsukawa1), Hiroki Goto1), Masanori Suzuki1), Masashi Nakamoto2), Ryo Matsumoto1), Hiroshi Utsunomiya1), Toshihiro Tanaka1)
1) Graduate School of Engineering, Osaka University 2) Graduate School of Engineering, Kyoto University

We have investigated metal–metal joining using “unusual wetting”, in which a liquid metal spreads by capillary action on a porous metal surface layer formed under atmospheric oxidation–reduction. Although oxidation–reduction creates an adequate porous structure for “unusual wetting”, it is difficult to subject only a specific area to atmospheric oxidation–reduction treatment, and region-selective “unusual wetting” and joining are not achieved. In this work, we propose the use of laser, which is able to treat regions selectively, to form a suitable structure for “unusual wetting”. A fine asperity structure was observed on the Cu substrate surface after laser treatment. This structure was termed a “surface fine crevice structure”. The wettability of the laser-treated Cu substrate by liquid Bi was determined to confirm region-selective “unusual wetting” on the “surface fine crevice structure”. We also joined two Cu substrates by “unusual wetting” after creating a “surface fine crevice structure”.


Keyword:
laser, wettability, capillary phenomenon, joining, copper, bismuth

Received: July 28, 2015
Accepted: August 28, 2015 , Published online: October 25, 2015

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