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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.46  No.10 (2005)  >  pp.2150-2155

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Superplasticity and Superplastic Diffusion Bonding of a Fine-Grained TiAl Alloy

Hanliang Zhu1), Bing Zhao2), Zhiqiang Li2) and Kouichi Maruyama1)
1) Graduate School of Environmental Studies, Tohoku University
2) Beijing Aeronautical Manufacturing Technology Research Institute

Superplasticity and superplastic diffusion bonding in a TiAl alloy with a fine-grained duplex microstructure have been investigated in order to fabricate TiAl alloy products using a combination process of superplastic forming with diffusion bonding. Superplastic tensile tests were carried out at temperatures ranging from 1000 to 1100°C, and at strain rates ranging from 10−5 to 10−3 s−1. A low superplastic flow stress of less than 25 MPa was observed at 1100°C and at a strain rate of 8.3×10−5 s−1. Under this condition, a tensile elongation of 300% and a strain rate sensitivity coefficient of over 0.5 were obtained. Furthermore, superplastic diffusion bonding under a low pressure of 10 MPa was conducted. Defect-free bonds were achieved at 1100°C for holding 1 h. It is suggested that the low superplastic flow stress at 1100°C allows a significant plastic flow between the two contacted surfaces, resulting in a full contact of the surfaces, which is necessary for the sound bonds. Finally, a two-sheet part of spherical dome was successfully produced from this alloy.

TiAl alloy, microstructure, superplasticity, diffusion bonding

Received: May 24, 2005
Accepted: August 02, 2005 , Published online: November 14, 2005
Copyright (c) 2005 The Japan Institute of Metals



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