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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.58  No.2 (2017)  >  pp.127-130

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Decrease in Process Pressure for Forming Au-to-Au Joints via Reduction Reaction of Ag2O

Taro Inoue1), Tomo Ogura1), Akio Hirose1)
1) Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University

In this study, we were able to form strong Au-to-Au joints using a silver oxide (Ag2O) paste sintered at 300℃. We successfully reduced the processing pressure applied during sintering by 0.5 MPa by optimizing the sintering conditions. Through X-ray diffraction phase analysis as well as crystallite size calculations, we observed a significant reduction (27%) in the crystallite size as the heating rate was increased from 10℃/min to 180℃/min. Scanning electron microscopy cross-sectional observations confirmed that the high heating rate facilitated sintering within the bonding layer. The bonded shear strength (maximum of 24 MPa) was higher than that of the conventional Pb-5Sn solder (18 MPa), proving the suitability of Ag2O paste as a potential lead-free bonding material for high-temperature applications.

Ag2O, nanoparticle, low-pressure sintering, process control

Received: May 24, 2016
Accepted: July 26, 2016 , Published online: January 25, 2017



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