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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.46  No.6 (2005)  >  pp.1271-1273

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Elastic Properties of Sn-Based Pb-Free Solder Alloys Determined by Ultrasonic Pulse Echo Method

Hiroyuki Tanaka1), Lang Feng Qun2), Osamu Munekata3), Toshihiko Taguchi3) and Toshio Narita2)
1) Hokkaido Industrial Research Institute
2) Graduate School of Engineering, Hokkaido University
3) Senju Metal Industry Co., Ltd.

The Young’s modulus (E) and Poisson’s ratio (ν) of Sn-based lead-free solders as Sn–3.5Ag, Sn–58Bi and Sn–9Zn (compositions in mass%) were measured at various temperatures between −50 and 100°C using an ultrasonic pulse echo method. The values of Young’s modulus and Poisson’s ratio were obtained at 25°C. These values coincide with the room temperature values in the literature. The Young’s modulus and Poisson’s ratio between −50 and 100°C were also measured for Sn–58Bi, Sn–9Zn, and Sn–37Pb.

Young’s modulus, Poisson’s ratio, lead free solder, ultrasonic pulse echo method

Received: December 13, 2004
Accepted: April 05, 2005 , Published online: October 18, 2005
Copyright (c) 2005 The Japan Institute of Metals



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