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Home  >  Journal list  >  Journal of the Society of Materials Science, Japan  >  Vol.55  No.3 (2006)  >  pp.335-340

Journal of the Society of Materials Science, Japan
<<Previous article Vol.55  No.3 (2006)   pp.335 - 340 Next article>>

Evaluation of Blind Via Hole Quality on Multi-Layer Printed Wiring Boards by Cu Direct Laser Drilling

Toshiki HIROGAKI1), Eiichi AOYAMA1), Keiji OGAWA2), Ryu MINAGI3), Toshiki MURAKAMI4) and Nobuyuki DOI4)
1) Dept. of Mech. Eng., Doshisha Univ.
2) Dept. of Mech. Systems Eng., The Univ. of Shiga Pref.
3) Santen Pharmaceutical Co., Ltd.
4) Doshisha Univ.

In the current manufacture of multi-layer printed wiring boards (PWBs), the method frequently used is to laminate the core with insulating resin as build-up layers. Then, micro-via drilling technology using laser has become the dominant method of drilling smaller blind via holes of build-up layer. Cu direct laser drilling attracts attention to a new method in this field. However, there is no reports dealing with Cu direct laser drilling of PWBs. The purpose of the present report is to research the feature of Cu direct laser drilling and establish the method in order to improve hole quality. Following conclusions were obtained : (1) The technique using the infrared thermography was proposed in order to examine the laser absorptance of the surface copper foil. (2) The method of mixing fillers in the build-up layer was effective to improve hole quality by reducing the difference of the laser processing threshold between the copper foil and the build-up layer. (3) The technique was established to estimate the overusing FEM analysis.

Cu direct laser drilling, Over hang, Thermography, Absorptance, Filler, Multi-layer printed wiring boards

Received: September 12, 2005
Published online: April 26, 2006
Copyright (c) 2006 by The Society of Materials Science, Japan



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