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Home  >  Journal list  >  Journal of the Society of Materials Science, Japan  >  Vol.56  No.10 (2007)  >  pp.913-919

Journal of the Society of Materials Science, Japan
<<Previous article Vol.56  No.10 (2007)   pp.913 - 919 Next article>>

Evaluation of Mechanical Properties and Nano-Structure Analysis of Au-20Sn and Au-12Ge Solders

Tatsuya NISHIYAMA1), Takeshi OGAWA2) and Hiroo SAKAMOTO3)
1) Aoyama Gakuin Univ.
2) Faculty of Sci. and Eng., Aoyama Gakuin Univ.
3) Mitsubishi Electric Co., Advanced Tech. R & D Center

Au alloys have great potentialities as solder joints of electronic packaging. However, studies on mechanical properties of Au solders, especially on creep properties, are very limited. Mechanical properties of Au-20Sn and Au-12Ge were measured by indentation tests ranging between nano and macro scales. First, macro indentation creep tests were carried out at various temperatures, i.e. 295K, 323K, 373K, 398K and 423K. It was found that the indentation creep deformation was observed at room temperature for Au-20Sn, while above 373K for Au-12Ge. Second, the indentation creep properties were measured for ζ and δ phases of Au-20Sn using a nano-indentation testing machine in order to investigate the influences of microstructure on the creep properties. Finally, we evaluated anisotropy of textured microstructure of Au-12Ge, where the dent shapes were distorted. This behavior was attributed to the three dimensional configurations, namely pile-up and sink-in. Based on the results of nano-indentation tests, numerical model for the microstructure of Au-12Ge was established and the mechanisms of the pile-up and sink-in were discussed.

Au solder, Indentation test, Indentation creep, Microstructure, Anisotropy, Plastic properties, Finite element method

Received: January 10, 2007
Published online: October 18, 2007
Copyright (c) 2007 by The Society of Materials Science, Japan



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