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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.48  No.9 (2007)  >  pp.2349-2352

MATERIALS TRANSACTIONS
<<Previous article Vol.48  No.9 (2007)   pp.2349 - 2352 Next article>>

Computation of Interfacial Thermal Resistance by Phonon Diffuse Mismatch Model

Haitao Wang1), Yibin Xu1), Masato Shimono2), Yoshihisa Tanaka3) and Masayoshi Yamazaki1)
1) Materials Database Station, National Institute for Materials Science
2) Computational Materials Science Center, National Institute for Materials Science
3) Composites and Coatings Center, National Institute for Materials Science


The thermal resistances of 1250 kinds of interface were computed at room temperature based on the phonon diffuse mismatch model. The result shows that the ratio of Debye temperature and the ratio of average sound velocity can be approximately used to characterize the difference of two materials in terms of interfacial thermal resistance. The high interfacial thermal resistances are composed of high and low Debye temperature materials. The low interfacial thermal resistances are composed of both similar Debye temperature materials, and their Debye temperatures are very high. The relation between the interfacial thermal resistance with the ratio of average sound velocity is similar to that of the ratio of Debye temperature.


Keyword:
interfacial thermal resistance, phonon diffuse mismatch, average sound velocity, Debye temperature, ratio

Received: April 23, 2007
Accepted: May 25, 2007 , Published online: August 25, 2007
Copyright (c) 2007 The Japan Institute of Metals

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