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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.43  No.8 (2002)  >  pp.1821-1826

MATERIALS TRANSACTIONS
<<Previous article Vol.43  No.8 (2002)   pp.1821 - 1826 Next article>>

Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate

Jeong-Won Yoon1), Chang-Bae Lee1) and Seung-Boo Jung1)
1) Department of Advanced Materials Engineering, Sungkyunkwan University

The growth kinetics of intermetallic compound layers formed between eutectic Sn–58Bi solder and (Cu, electroless Ni–P/Cu) substrate were investigated at temperature between 70 and 120°C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn–58Bi/Cu and Sn–58Bi/electroless Ni–P system satisfied the parabolic law at given temperature range. As a whole, because the values of time exponent (n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by diffusion mechanism over the temperature range studied. The apparent activation energies of Cu6Sn5 and Ni3Sn4 intermetallic compound in the couple of the Sn–58Bi/Cu and Sn–58Bi/electroless Ni–P were 127.9 and 81.6 kJ/mol, respectively.


Keyword:
tin-58bismuth solder, growth kinetics, intermetallic compound, time exponent(n), activation energy

Received: February 25, 2002
Accepted: July 15, 2002 , Published online: September 06, 2005
Copyright (c) 2005 The Japan Institute of Metals

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