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Home  >  Journal list  >  Journal of the Society of Materials Science, Japan  >  Vol.54  No.10 (2005)  >  pp.999-1004

Journal of the Society of Materials Science, Japan
<<Previous article Vol.54  No.10 (2005)   pp.999 - 1004 Next article>>

Lead-Free Bonding Process Using Ag Nanoparticles for High Temperature Packaging

Eiichi IDE1), Akio HIROSE1) and Kojiro F. KOBAYASHI1)
1) Dept. of Manufacturing Sci., Graduate School of Eng., Osaka Univ.


We have proposed a novel bonding process using Ag metallo-organic nanoparticles with average particle size of around 11 nm, which can be alternative to lead-rich high melting point solders. The influences of bonding parameters on the bondability of Cu-to-Cu joints were examined based on the measurement of the shear strength of the joints and the observation of fracture surfaces and cross-sectional microstructures. The joints using Ag metallo-organic nanoparticles had strength ranging from 10 MPa to 50 MPa depending on bonding conditions. From the results, the bonding conditions providing the joint strength equivalent to those using the lead-rich high melting point solders were proposed.


Keyword:
Nanoparticle, Bonding to Cu, Lead-free high melting point solder, Sintering, Shear strength

Received: January 14, 2005
Published online: April 07, 2006
Copyright (c) 2006 by The Society of Materials Science, Japan

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