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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.45 No.3 (2004)

MATERIALS TRANSACTIONS
<<Previous issue Vol.45 No.3 (2004) Next issue>>

Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface
( pp.606 - 613 )
Tao-Chih Chang1), Min-Hsiung Hon1) and Moo-Chin Wang2)

 
Thermodynamic Study of Phase Equilibria in the Sn-Ag-Bi-Zn Quaternary System
( pp.614 - 624 )
Hiroshi Ohtani1), Seiichi Ono2), Kodai Doi3) and Mitsuhiro Hasebe1)

 
Effect of Oxygen on Surface Tension of Liquid Ag-Sn Alloys
( pp.625 - 629 )
Joonho Lee1), Toshihiro Tanaka1), Masaya Yamamoto2) and Shigeta Hara1)

 
Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging
( pp.630 - 636 )
S. Vaynman1), G. Ghosh1) and M.E. Fine1)

 
Thermodynamic Calculations of Phase Equilibria, Surface Tension and Viscosity in the In-Ag-X (X=Bi, Sb) System
( pp.637 - 645 )
Xing Jun Liu1), Tokuro Yamaki1), Ikuo Ohnuma1), Ryosuke Kainuma1) and Kiyohito Ishida1)

 
Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate
( pp.646 - 651 )
Yoshikazu Takaku1), Xing Jun Liu1), Ikuo Ohnuma1), Ryosuke Kainuma1) and Kiyohito Ishida1)

 
Surface Tension and Density Measurements of Sn-Ag-Sb Liquid Alloys and Phase Diagram Calculations of the Sn-Ag-Sb ternary system
( pp.652 - 660 )
Zbigniew Moser1), Wladyslaw Gasior1), Janusz Pstrus1), Satoru Ishihara2), Xing Jun Liu3), Ikuo Ohnuma3), Ryosuke Kainuma3) and Kiyohito Ishida3)

 
Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints
( pp.661 - 665 )
Sinn-wen Chen1), Shih-kang Lin1) and Jui-meng Jao1)

 
Vibration Fracture Behavior of Sn-Bi Solder Alloys with Various Bi Contents
( pp.666 - 672 )
Jenn-Ming Song1), Yea-Luen Chang1), Truan-Sheng Lui1) and Li-Hui Chen1)

 
Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition
( pp.673 - 680 )
Shinichi Terashima1), Yoshiharu Kariya2) and Masamoto Tanaka1)

 
Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects
( pp.681 - 688 )
Shinichi Terashima1) and Masamoto Tanaka1)

 
Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects
( pp.689 - 694 )
Yoshiharu Kariya1), Takuya Hosoi2), Takashi Kimura1), Shinichi Terashima3) and Masamoto Tanaka3)

 
The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints
( pp.695 - 702 )
Sung K. Kang1), Paul Lauro1), Da-Yuan. Shih1), Donald W. Henderson2), Jay Bartelo2), Timothy Gosselin2), Steve R. Cain2), Charles Goldsmith3), Karl Puttlitz3), Tae K. Hwang4) and Won K. Choi5)

 
Novel Ultrasonic Soldering Technique for Lead-Free Solders
( pp.703 - 709 )
Keitaro Kago1), Kenichiro Suetsugu2), Shunji Hibino3), Takashi Ikari2), Akio Furusawa2), Hiroaki Takano4), Toshihisa Horiuchi5), Kenji Ishida1)5), Takuma Sakaguchi5), Shiomi Kikuchi6) and Kazumi Matsushige1)5)

 
Abnormal Grain Growth of Ni3Sn4 at Sn-3.5Ag/Ni Interface
( pp.710 - 713 )
Jong Hoon Kim1), Sang Won Jeong1) and Hyuck Mo Lee1)

 
Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni
( pp.714 - 720 )
Chi-Won Hwang1) and Katsuaki Suganuma1)

 
Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM
( pp.721 - 726 )
Kyung-Seob Kim1), Jun-Mo Yang2), Chong-Hee Yu3) and Hyo-Joeng Jeon4)

 
IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
( pp.727 - 733 )
Jeong-Won Yoon1), Sang-Won Kim1) and Seung-Boo Jung1)

 
Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating
( pp.734 - 740 )
Yousuke Sogo1), Takashi Hojo1), Hiroaki Iwanishi1), Akio Hirose1), Kojiro F. Kobayashi1), Atsushi Yamaguch2), Akio Furusawa2) and Kazuto Nishida2)

 
Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder
( pp.741 - 746 )
Hiroshi Nishikawa1), Tadashi Takemoto1), Kouichi Kifune2), Takashi Uetani3) and Norihisa Sekimori3)

 
Influence of Noble Metal Coating on Wettability of Copper Substrate by Sn-Ag Eutectic Solder
( pp.747 - 753 )
Hisaaki Takao1) and Hideo Hasegawa1)

 
Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls
( pp.754 - 758 )
Ikuo Shohji1), Yuji Shiratori1), Hiroshi Yoshida2), Masahiko Mizukami2) and Akira Ichida2)

 
Application of Thermal Latent Carboxylic Acid Derivatives to Pb-Free Microsoldering
( pp.759 - 764 )
Shun Saito1), Katumi Nakasato1), Yukihiro Katoh1), Yoshihiro Oshibe1) and Masahiro Ishidoya2)

 
Development of Sn-Based, Low Melting Temperature Pb-Free Solder Alloys
( pp.765 - 775 )
Paul Vianco1), Jerome Rejent1) and Richard Grant1)

 
Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys
( pp.776 - 782 )
Jenn-Ming Song1), Nai-Shuo Liu1) and Kwang-Lung Lin1)

 
Microstructure and Strength of Sn-Bi Coated Sn-3.5 mass%Ag Solder Alloy
( pp.783 - 789 )
Jaesik Lee1), Woongho Bang2), Jaepil Jung1) and Kyuhwan Oh2)

 
Eutectic Alloys in the Sn-Zn-Mg-Al System with Eutectic Temperature of 454 K
( pp.790 - 792 )
Masanori Inada1) and Masaki Kibe1)

 
The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly
( pp.793 - 798 )
Jong-Min Kim1), Kiyokazu Yasuda1), Masahiro Yasuda1) and Kozo Fujimoto1)

 
Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive
( pp.799 - 805 )
Kiyokazu Yasuda1), Jong-Min Kim1), Masahiro Yasuda1) and Kozo Fujimoto1)

 
TiO2 Nanoparticle Suspension Preparation Using Ultrasonic Vibration-Assisted Arc-Submerged Nanoparticle Synthesis System (ASNSS)
( pp.806 - 811 )
Ho Chang1), Tsing-Tshih Tsung1), Liang-Chia Chen2), Yi-Cheng Yang1), Hong-Ming Lin3), Lee-Long Han1) and Chung-Kwei Lin4)

 
Giant Magnetoimpedance in (Co0.85Fe0.06Nb0.02Ni0.07)75Si10B15 Amorphous Ribbon
( pp.812 - 817 )
Jifan Hu1), Hongwei Qin1), Tao Han1) and Juan Chen1)

 
Morphological Evolution of Grain-Boundary SiO2 in Internally Oxidized Cu-Si Bicrystals
( pp.818 - 823 )
Hisashi Sato1), Ibuki Ota1), Toshiyuki Fujii1), Susumu Onaka1) and Masaharu Kato2)

 
Flat Cavities formed in TZP caused by Superplastic Deformations at High Strain-Rates and Their Effect on Elongation
( pp.824 - 832 )
Stefanus Harjo1), Jan Šaroun2), Yoshinobu Motohashi1), Naoki Kojima1), Vasyl Ryukthin2), Pavel Strunz2)3), Matthias Baron4)5) and Rudolf Loidl4)5)

 
Computer Simulation of Formation Energy and Migration Energy of Vacancies under High Strain in Cu
( pp.833 - 838 )
Koichi Sato1), Toshimasa Yoshiie1), Yuhki Satoh2) and Qiu Xu1)

 
Notch Size Effects in the Fatigue Characteristics of Al-Si-Cu-Mg Cast Alloy
( pp.839 - 843 )
Yusaku Maruno1), Hirofumi Miyahara1), Hiroshi Noguchi2) and Keisaku Ogi1)

 
Evaporation of Phosphorus in Molten Silicon by an Electron Beam Irradiation Method
( pp.844 - 849 )
Kazuhiro Hanazawa1), Noriyoshi Yuge1) and Yoshiei Kato1)

 
Removal of Metal Impurities in Molten Silicon by Directional Solidification with Electron Beam Heating
( pp.850 - 857 )
Noriyoshi Yuge1), Kazuhiro Hanazawa1) and Yoshiei Kato1)

 
Boron Removal in Molten Silicon by a Steam-Added Plasma Melting Method
( pp.858 - 864 )
Naomichi Nakamura, Hiroyuki Baba, Yasuhiko Sakaguchi1) and Yoshiei Kato

 
Beneficial Effect of Sulfur State on High-Temperature Steam Oxidation Resistance in High Chromium Ferritic Steels
( pp.865 - 869 )
Masaaki Nakai1), Yoshinori Murata1), Masahiko Morinaga1) and Yasutoshi Sasaki1)

 
Filament and Droplets Formed Behind a Solid Sphere Rising Across a Liquid-Liquid Interface
( pp.870 - 876 )
Momoko Abe1) and Manabu Iguchi2)

 
Agglomeration of Copper Thin Film in Cu/Ta/Si Structure
( pp.877 - 879 )
Joon Woo Bae1), Jae-Won Lim1), Kouji Mimura1) and Minoru Isshiki1)

 
Effect of Heat Treatment on Microstructure and Properties of Semi-solid Chromium Cast Iron
( pp.880 - 887 )
Nuchthana Poolthong1), Hiroyuki Nomura2) and Mitsuharu Takita2)

 
Effect of Al on Bulk Amorphization and Magnetic Properties of FeSnPSiB Alloys
( pp.888 - 892 )
Chih-Yuan Lin1), Tsung-Shune Chin1)2), Chih-Kang Chao1), Siao-Xion Zhou3), Zhih-Chao Lu3), Li Wang3), Fei-Fei Chen3), Ming-Xiang Pan4) and Wei-Hua Wang4)

 
Simulation of Droplet Ejection for a Piezoelectric Inkjet Printing Device
( pp.893 - 899 )
Hsuan-Chung Wu1), Huey-Jiuan Lin2), Yung-Chi Kuo3) and Weng-Sing Hwang1)

 
Preparation of IrO2 Thin Films by Oxidating Laser-ablated Ir
( pp.900 - 903 )
Yuxue Liu1), Hiroshi Masumoto1) and Takashi Goto1)

 
Effect of Mg on the Sintering of Al-Mg Alloy Powders by Pulse Electric-Current Sintering Process
( pp.904 - 909 )
Guoqiang Xie1), Osamu Ohashi1), Takahiro Sato1), Norio Yamaguchi1), Minghui Song2), Kazutaka Mitsuishi2) and Kazuo Furuya2)

 
An Air Cavity Formed Behind a Poorly Wetted Sphere Penetrating into a Water Bath
( pp.910 - 917 )
Nao Shimamoto1), Manabu Iguchi2), Tomomasa Uemura3) and Noriyoshi Yonehara3)

 
Crystallographic Anisotropy Control of n-type Bi-Te-Se Thermoelectric Materials via Bulk Mechanical Alloying and Shear Extrusion
( pp.918 - 924 )
Sang Seok Kim1) and Tatsuhiko Aizawa1)

 
Determination of Trace Elements in High-Purity Molybdenum by Solid-Phase Extraction/ICP-MS
( pp.925 - 929 )
Shin-ichi Hasegawa1), Hitoshi Yamaguchi1), Katsura Yamada1) and Takeshi Kobayashi1)

 
Shape Memory Effect and Crystallographic Investigation in VN Containing Fe-Mn-Si-Cr Alloys
( pp.930 - 935 )
Susan Farjami1), Kenji Hiraga2) and Hiroshi Kubo3)

 
Fracture Toughness of JLF-1 by Miniaturized 3-Point Bend Specimens with 3.3—7.0 mm Thickness
( pp.936 - 941 )
Hiroaki Kurishita1), Takuya Yamamoto1), Takuya Nagasaka2), Arata Nishimura2), Takeo Muroga2) and Shiro Jitsukawa3)

 
Improvement of the Surface Layer of Steel Using Microwave Plasma Nitriding
( pp.942 - 946 )
Khyoupin Khoo1), Manabu Takeuchi2), Jin Onuki2) and Takao Komiyama3)

 
Adherence of Porcelain Veneered on Titanium with an Intermediate Plasma-Sprayed Zirconia Layer
( pp.947 - 952 )
Tsung-Nan Lo1), Edward Chang1) and Truan-Sheng Lui1)

 
Electron-Phonon Mechanism of ω Phase Transformation
( pp.953 - 957 )
Jianfeng Wan1), Xiaolin Lei2), Shipu Chen1) and Zuyao Xu1)

 
Effect of ECAP Strain on Deformation Behavior at Low Temperature Superplastic Regime of Ultrafine Grained 5083 Al Alloy Fabricated by ECAP
( pp.958 - 963 )
Kyung-Tae Park1), Hang-Jae Lee1), Chong Soo Lee2), Byung Du Ahn3), Hyun Soo Cho3) and Dong Hyuk Shin3)

 
Synthesis of Au/TiO2 Core-shell Structure Nanoparticles and the Crystallinity of TiO2 Shell
( pp.964 - 967 )
Yeon-tae Yu1) and Paul Mulvaney2)

 
Influence of Sulfate Ions on Conversion of Fe(OH)3 Gel to β-FeOOH and α-Fe2O3
( pp.968 - 971 )
Kiyoshi Kanie1), Atsushi Muramatsu1), Shigeru Suzuki1) and Yoshio Waseda1)

 
Fractal Characteristics of the Solidification Process
( pp.972 - 975 )
Maricel Agop1)2), Pavlos Ioannou1), Petru Nica1)2), Cristina Radu2), Adrian Alexandru3) and Petre Vizureanu3)

 


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