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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.43  No.8 (2002)  >  pp.1816-1820

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Numerical Simulation of Dynamic Wetting Behavior in the Wetting Balance Method

Jeong Whan Han1), Hwang Gu Lee2) and Jae Yong Park3)
1) School of Materials Science & Engineering, Assistant Professor, Inha University
2) School of Materials Science & Engineering, Graduate Student, Inha University
3) Material Science & Engineering, Post-doctoral Fellow, UTA

Wetting balance test is known to be the most versatile method to evaluate wettability during soldering process, because it provides quantitative information and time dependent wetting behavior. There are many other studies exist related with the wetting force, however, as to wetting time, there are few theoretical backgrounds and mathematical analysis. In this study, the wetting time is focused on a wettability index. The wetting curve, which shows time dependant wetting behavior, is predicted by using computer simulation and compared with oil experiment also, the mechanism of meniscus rise is analyzed. As a result, relationship of calculated and measured wetting curve can be obtained. It is found that the viscosity of a liquid is the major variable that determine the wetting time and wetting rate.

wetting balance method, computer simulation, wetting time, wetting force, wettability, solderability

Received: February 18, 2002
Accepted: June 12, 2002 , Published online: September 06, 2005
Copyright (c) 2005 The Japan Institute of Metals



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