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Home  >  Journal list  >  MATERIALS TRANSACTIONS  >  Vol.49  No.4 (2008)  >  pp.889-891

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Equal Channel Angular Extrued Bi0.5Sb1.5Te3 Thermoelectric Compound

CheolHo Lim1), KyungTaek Kim2), YongHwan Kim2), ChangHun Lee1) and ChiHwan Lee1)
1) Dept. of Metallurgical Engineering, College of Engineering, Inha University
2) New Functional Materials Team, Korea Institute of Industrial Technology

The effects of equal channel angular extrusion (ECAE) process parameters on microstructure and thermoelectric properties of the p-type Bi0.5Sb1.5Te3 compound have been investigated. ECAE was carried out under various temperatures (653 K, 693 K, 733 K) and ram speeds (0.5 mm/s, 1 mm/s, 2 mm/s). Fraction of recrystallized grains and grain size was found to be increase with lower ram speed and higher deformation temperature. As a result, Seebeck coefficient increased, and electrical resistivity and thermal conductivity decreased. The decrease in thermal conductivity was attributed to the decrease of lattice thermal conductivity (κph) which is independent of electrical properties. Maximum figure-of-merit (2.87×10−3 K−1) was achieved in as-ECAE’ed specimen at 733 K and at ram speed of 0.5 mm/s. This value was found to be 6% higher than that of as-sintered specimen.

thermoelectric, Bi2Te3, equal channel angular extrusion

Received: November 27, 2007
Accepted: February 13, 2008 , Published online: March 25, 2008
Copyright (c) 2008 The Japan Institute of Metals



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